G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds Revision:SEMI G69-0996 (Reapproved 1104) - Superseded Packaging assembly service offered: BGA

Packaging assembly service offered: BGA

本スタンダードは，FPD偏光板および関連材料の防汚性と耐薬品性の評価方法を確立する。

SEMI E37-0413 (designation update)

SEMI D19-1019 (technical revision)

SEMI E28-1110 (technical revision)

G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds Revision:SEMI G69-0996 (Reapproved 1104) - Superseded Packaging assembly service offered: BGAThis Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three point bending techniques. This Standard may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a